Product Information
Precision and quality in every detail.
Silicon
Silicon Processing Technology
Since its excellent thermal conductivity, high temperature resistance and chemical stability, silicon is widely used in semiconductor processes, micro-electromechanical systems (MEMS) and high-tech fields. K-Max Technology provides high-quality silicon material solutions with precision processing technology to meet diverse needs
Core Processing Capabilities
- CNC Precision Machining:
- High-accuracy processes suitable for thin silicon materials and complex components.
- Micron-level machining precision, capable of handling high aspect ratios and 3D geometries.
- Surface Grinding and Polishing:
- Achieves surface roughness (Ra) as low as 0.01 μm, ensuring ultra-flatness and superior optical performance.
- Chemical etching techniques enhance surface quality and reliability.
- Customized Solutions:
- One-stop service from design to mass production, supporting prototyping and process optimization.
Silicon Material Properties
- High Purity (6N grade and above): Reduces impurity interference and enhances product performance.
- Excellent Thermal Conductivity: Ensures stability in high-power applications.
- High Corrosion Resistance and Mechanical Strength: Suitable for highly corrosive environments and precision machining requirements.
- Adjustable Resistivity: Available in high, medium, and low resistivity options.
Advantages of Application in Semiconductor Etching Machines
- Plasma Stability: The uniform distribution of electric fields and plasma density by silicon rings enhances etching precision.
- Reduced Contamination: High corrosion resistance reduces particle generation, thereby extending equipment lifetime.
- Upper Electrode Application:
- Controls electric field distribution, improves gas uniformity, and protects the electrode from corrosion.
- Lower Electrode Application:
- Restricts plasma range, concentrates energy in the processing area, and improves wafer process consistency.
